Electronics Forum | Thu Sep 23 07:04:15 EDT 1999 | joel cruz
I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. I Hope than you send my information about this.
Electronics Forum | Wed Jan 27 02:07:25 EST 2021 | davef
IPC-7525 does a good job of giving guidelines for designing stencils, including stepped stencils
Electronics Forum | Tue Feb 02 09:01:34 EST 2021 | denism
The main feature of the step on the stencil is the excess of paste on adjacent components. Clearance between step and fine pitch components must be at least 10 mm. Might better try over printing?
Electronics Forum | Thu Jan 28 22:27:00 EST 2021 | emeto
Nowadays is not a big deal to cut step stencils. Stencil houses charge you around 100USD per step in addition to your regular price. Some places are welding the step area with a very small clearance and I have to say mostly it is pretty accurate. In
Electronics Forum | Tue Feb 02 22:57:32 EST 2021 | pnguyvu
Hello Charliem, Contact Steve Yen ( Steve@usastencils.com )at USA STENICLS INC. He'll give you better idea overprint or step . He has solid experience in design smt stencil. We've been receiving very good stencil from Steve.
Electronics Forum | Fri Feb 05 02:40:40 EST 2021 | victorzubashev
For components with the large pads, you can also use secondary soldering dispensing. Some printers like DEK have an option to mount a syringe with an auger valve to do dispensing after the printing step process. Obviously will not work if you have to
Electronics Forum | Tue Jan 26 16:29:48 EST 2021 | charliedci
We will be exploring the exciting world of step stencils for the first time and I am looking for any advice from anyone using regularly. This direction is because we have large caps and soldered standoffs along with medium pitch LGA's and QFP's on sa
Electronics Forum | Fri Sep 24 12:37:13 EDT 1999 | Terry Burnette
.032" pitch, and OSP copper pads on boards with devices that have
Electronics Forum | Fri Sep 24 14:02:02 EDT 1999 | Earl Moon
.032" pitch, and OSP copper pads on boards with devices that have
Electronics Forum | Mon Sep 27 08:45:42 EDT 1999 | Wolfgang Busko
.032" pitch, and OSP copper pads on boards with devices that have
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